(BESI) BE Semiconductor Industries - Overview

Sector: Technology | Industry: Semiconductor Equipment & Materials | Exchange: AS (Netherlands) | Market Cap: 20.740m EUR | Total Return: 150% in 12m

Die Attach, Packaging, Plating, Molding Systems, Singulation
Total Rating 75
Safety 79
Buy Signal 0.86
Semiconductor Equipment & Materials
Industry Rotation: -9.4
Market Cap: 24.1B
Avg Turnover: 111M
Risk 3d forecast
Volatility47.1%
VaR 5th Pctl8.03%
VaR vs Median3.55%
Reward TTM
Sharpe Ratio2.01
Rel. Str. IBD95.6
Rel. Str. Peer Group43.1
Character TTM
Beta1.206
Beta Downside0.756
Hurst Exponent0.506
Drawdowns 3y
Max DD54.52%
CAGR/Max DD0.80
CAGR/Mean DD2.26
EPS (Earnings per Share) EPS (Earnings per Share) of BESI over the last years for every Quarter: "2021-03": 0.55, "2021-06": 1.12, "2021-09": 1, "2021-12": 0.8, "2022-03": 0.89, "2022-06": 0.9, "2022-09": 0.69, "2022-12": 0.5, "2023-03": 0.44, "2023-06": 0.66, "2023-09": 0.45, "2023-12": 0.68, "2024-03": 0.44, "2024-06": 0.53, "2024-09": 0.59, "2024-12": 0.74, "2025-03": 0.4, "2025-06": 0.4, "2025-09": 0.32, "2025-12": 0.54, "2026-03": 0.65,
EPS CAGR: -6.95%
EPS Trend: -64.2%
Last SUE: 0.00
Qual. Beats: 0
Revenue Revenue of BESI over the last years for every Quarter: 2021-03: 143.203, 2021-06: 226.056, 2021-09: 208.306, 2021-12: 171.732, 2022-03: 202.407, 2022-06: 213.958, 2022-09: 168.784, 2022-12: 137.721, 2023-03: 133.406, 2023-06: 162.501, 2023-09: 123.32, 2023-12: 159.635, 2024-03: 146.314, 2024-06: 151.176, 2024-09: 156.57, 2024-12: 153.413, 2025-03: 144.145, 2025-06: 148.101, 2025-09: 132.731, 2025-12: 166.354, 2026-03: 184.879,
Rev. CAGR: 1.79%
Rev. Trend: 47.8%
Last SUE: -0.17
Qual. Beats: 0

Warnings

P/E ratio 137.1

Tailwinds

Supp Ema20, Tailwind, Confidence

Description: BESI BE Semiconductor Industries

BE Semiconductor Industries N.V. (Besi) designs and services high-precision assembly equipment for the global semiconductor and electronics industries. Operating through Die Attach, Packaging, and Plating segments, the company provides systems for die bonding, wafer-level packaging, and singulation under brands such as Fico, Meco, Datacon, and Esec.

The business model centers on the back-end of semiconductor manufacturing, where processed wafers are assembled into finished chips. Besi is a key player in the advanced packaging market, a sector currently driven by the demand for heterogeneous integration and high-performance computing applications.

Headquartered in the Netherlands, the company serves a diverse client base including multinational chip manufacturers, independent foundries, and assembly subcontractors. You can further analyze these market dynamics and competitive positioning on ValueRay.

Headlines to Watch Out For
  • Hybrid bonding adoption accelerates revenue growth in high-end artificial intelligence applications
  • Expansion of advanced packaging capacity by foundries drives die attach equipment orders
  • Cyclical volatility in mainstream computing and smartphone markets impacts quarterly earnings performance
  • Competitive pressure in thermal compression bonding affects long-term market share and margins
  • Shift toward fan-out wafer level packaging increases demand for precision molding systems
Piotroski VR‑10 (Strict) 8.5
Net Income: 151.7m TTM > 0 and > 6% of Revenue
FCF/TA: 0.17 > 0.02 and ΔFCF/TA 3.93 > 1.0
NWC/Revenue: 117.6% < 20% (prev 140.0%; Δ -22.36% < -1%)
CFO/TA 0.19 > 3% & CFO 226.7m > Net Income 151.7m
Net Debt (-81.0m) to EBITDA (243.3m): -0.33 < 3
Current Ratio: 4.74 > 1.5 & < 3
Outstanding Shares: last quarter (79.5m) vs 12m ago -2.54% < -2%
Gross Margin: 61.45% > 18% (prev 0.64%; Δ 6.08k% > 0.5%)
Asset Turnover: 51.85% > 50% (prev 48.86%; Δ 3.00% > 0%)
Interest Coverage Ratio: 7.49 > 6 (EBITDA TTM 243.3m / Interest Expense TTM 27.7m)
Altman Z'' 5.70
A: 0.62 (Total Current Assets 942.7m - Total Current Liabilities 199.1m) / Total Assets 1.20b
B: 0.10 (Retained Earnings 118.8m / Total Assets 1.20b)
C: 0.17 (EBIT TTM 207.1m / Avg Total Assets 1.22b)
D: 0.16 (Book Value of Equity 118.8m / Total Liabilities 742.0m)
Altman-Z'' = 5.70 = AAA
Beneish M -2.90
DSRI: 1.05 (Receivables 186.4m/170.4m, Revenue 632.1m/605.3m)
GMI: 1.05 (GM 61.45% / 64.33%)
AQI: 1.12 (AQ_t 0.16 / AQ_t-1 0.14)
SGI: 1.04 (Revenue 632.1m / 605.3m)
TATA: -0.06 (NI 151.7m - CFO 226.7m) / TA 1.20b)
Beneish M = -2.90 (Cap -4..+1) = A
What is the price of BESI shares? As of May 22, 2026, the stock is trading at EUR 270.40 with a total of 341,710 shares traded.
Over the past week, the price has changed by +1.39%, over one month by +19.40%, over three months by +45.01% and over the past year by +149.98%.
Is BESI a buy, sell or hold? BE Semiconductor Industries has no consensus analysts rating.
What are the forecasts/targets for the BESI price?
Analysts Target Price - -
BE Semiconductor Industries (BESI) - Fundamental Data Overview as of 18 May 2026
Market Cap USD = 24.11b (20.74b EUR * 1.1625 EUR.USD)
P/E Trailing = 137.0681
P/E Forward = 68.0272
P/S = 32.8129
P/B = 45.2184
P/EG = 2.1494
Revenue TTM = 632.1m EUR
EBIT TTM = 207.1m EUR
EBITDA TTM = 243.3m EUR
Long Term Debt = 507.0m EUR (from longTermDebt, last fiscal year)
 Short Term Debt = unknown (none)
 Debt = 530.4m EUR (from shortLongTermDebtTotal, last quarter) + Leases 11.3m
Net Debt = -81.0m EUR (calculated: Debt 530.4m - CCE 611.4m)
Enterprise Value = 20.66b EUR (20.74b + Debt 530.4m - CCE 611.4m)
Interest Coverage Ratio = 7.49 (Ebit TTM 207.1m / Interest Expense TTM 27.7m)
EV/FCF = 101.1x (Enterprise Value 20.66b / FCF TTM 204.3m)
FCF Yield = 0.99% (FCF TTM 204.3m / Enterprise Value 20.66b)
FCF Margin = 32.32% (FCF TTM 204.3m / Revenue TTM 632.1m)
Net Margin = 24.00% (Net Income TTM 151.7m / Revenue TTM 632.1m)
Gross Margin = 61.45% ((Revenue TTM 632.1m - Cost of Revenue TTM 243.6m) / Revenue TTM)
Gross Margin QoQ = 60.30% (prev 63.86%)
Tobins Q-Ratio = 17.23 (Enterprise Value 20.66b / Total Assets 1.20b)
Interest Expense / Debt = 1.15% (Interest Expense 6.10m / Debt 530.4m)
Taxrate = 12.19% (7.16m / 58.7m)
NOPAT = 181.9m (EBIT 207.1m * (1 - 12.19%))
Current Ratio = 4.74 (Total Current Assets 942.7m / Total Current Liabilities 199.1m)
Debt / Equity = 1.16 (Debt 530.4m / totalStockholderEquity, last quarter 456.9m)
Debt / EBITDA = -0.33 (Net Debt -81.0m / EBITDA 243.3m)
Debt / FCF = -0.40 (Net Debt -81.0m / FCF TTM 204.3m)
Total Stockholder Equity = 397.8m (last 4 quarters mean from totalStockholderEquity)
RoA = 12.45% (Net Income 151.7m / Total Assets 1.20b)
RoE = 38.13% (Net Income TTM 151.7m / Total Stockholder Equity 397.8m)
RoCE = 22.89% (EBIT 207.1m / Capital Employed (Equity 397.8m + L.T.Debt 507.0m))
RoIC = 46.83% (NOPAT 181.9m / Invested Capital 388.4m)
WACC = 10.00% (E(20.74b)/V(21.27b) * Re(10.23%) + D(530.4m)/V(21.27b) * Rd(1.15%) * (1-Tc(0.12)))
Discount Rate = 10.23% (= CAPM, Blume Beta Adj.)
Shares (quarterly) Correlation: -95.56 | Cagr: -1.44%
[DCF] Terminal Value 70.25% ; FCFF base≈187.5m ; Y1≈175.7m ; Y5≈163.6m
[DCF] Fair Price = 27.88 (EV 2.13b - Net Debt -81.0m = Equity 2.21b / Shares 79.2m; r=10.00% [WACC]; 5y FCF grow -8.07% → 3.0% )
EPS Correlation: -64.23 | EPS CAGR: -6.95% | SUE: 0.0 | # QB: 0
Revenue Correlation: 47.82 | Revenue CAGR: 1.79% | SUE: -0.17 | # QB: 0
EPS current Quarter (2026-06-30): EPS=1.13 | Chg30d=+35.62% | Revisions=+64% | Analysts=7
EPS next Quarter (2026-09-30): EPS=1.14 | Chg30d=+25.46% | Revisions=+64% | Analysts=7
EPS current Year (2026-12-31): EPS=3.92 | Chg30d=+10.49% | Revisions=+68% | GrowthEPS=+135.9% | GrowthRev=+57.9%
EPS next Year (2027-12-31): EPS=5.83 | Chg30d=+10.60% | Revisions=+78% | GrowthEPS=+48.9% | GrowthRev=+32.8%
[Analyst] Revisions Ratio: +78%