(BESI) BE Semiconductor Industries - Overview

Sector: Technology | Industry: Semiconductor Equipment & Materials | Exchange: AS (Netherlands) | Market Cap: 21.420m EUR | Total Return: 165.8% in 12m

Die Attach, Packaging, Plating, Molding Systems, Singulation
Total Rating 69
Safety 78
Buy Signal 1.19
Semiconductor Equipment & Materials
Industry Rotation: -17.6
Market Cap: 24.9B
Avg Turnover: 110M
Risk 3d forecast
Volatility47.1%
VaR 5th Pctl8.05%
VaR vs Median3.85%
Reward TTM
Sharpe Ratio2.18
Rel. Str. IBD95.8
Rel. Str. Peer Group50
Character TTM
Beta1.227
Beta Downside0.756
Hurst Exponent0.473
Drawdowns 3y
Max DD54.52%
CAGR/Max DD0.83
CAGR/Mean DD2.34
EPS (Earnings per Share) EPS (Earnings per Share) of BESI over the last years for every Quarter: "2021-03": 0.55, "2021-06": 1.12, "2021-09": 1, "2021-12": 0.8, "2022-03": 0.89, "2022-06": 0.9, "2022-09": 0.69, "2022-12": 0.5, "2023-03": 0.44, "2023-06": 0.66, "2023-09": 0.45, "2023-12": 0.68, "2024-03": 0.44, "2024-06": 0.53, "2024-09": 0.59, "2024-12": 0.74, "2025-03": 0.4, "2025-06": 0.4, "2025-09": 0.32, "2025-12": 0.54, "2026-03": 0.65,
EPS CAGR: -6.95%
EPS Trend: -64.2%
Last SUE: 0.00
Qual. Beats: 0
Revenue Revenue of BESI over the last years for every Quarter: 2021-03: 143.203, 2021-06: 226.056, 2021-09: 208.306, 2021-12: 171.732, 2022-03: 202.407, 2022-06: 213.958, 2022-09: 168.784, 2022-12: 137.721, 2023-03: 133.406, 2023-06: 162.501, 2023-09: 123.32, 2023-12: 159.635, 2024-03: 146.314, 2024-06: 151.176, 2024-09: 156.57, 2024-12: 153.413, 2025-03: 144.145, 2025-06: 148.101, 2025-09: 132.731, 2025-12: 166.354, 2026-03: 184.879,
Rev. CAGR: 1.79%
Rev. Trend: 47.8%
Last SUE: -0.17
Qual. Beats: 0

Warnings

P/E ratio 140.8

Tailwinds

Supp Ema20, Rs Leader, Idiosyncratic Leader, Tailwind, Confidence

Description: BESI BE Semiconductor Industries

BE Semiconductor Industries N.V. (Besi) designs and services high-precision assembly equipment for the global semiconductor and electronics industries. Operating through Die Attach, Packaging, and Plating segments, the company provides systems for die bonding, wafer-level packaging, and singulation under brands such as Fico, Meco, Datacon, and Esec.

The business model centers on the back-end of semiconductor manufacturing, where processed wafers are assembled into finished chips. Besi is a key player in the advanced packaging market, a sector currently driven by the demand for heterogeneous integration and high-performance computing applications.

Headquartered in the Netherlands, the company serves a diverse client base including multinational chip manufacturers, independent foundries, and assembly subcontractors. You can further analyze these market dynamics and competitive positioning on ValueRay.

Headlines to Watch Out For
  • Hybrid bonding adoption accelerates revenue growth in high-end artificial intelligence applications
  • Expansion of advanced packaging capacity by foundries drives die attach equipment orders
  • Cyclical volatility in mainstream computing and smartphone markets impacts quarterly earnings performance
  • Competitive pressure in thermal compression bonding affects long-term market share and margins
  • Shift toward fan-out wafer level packaging increases demand for precision molding systems
Piotroski VR-10 (Strict) 7.5
Net Income: 151.7m TTM > 0 and > 6% of Revenue
FCF/TA: 0.15 > 0.02 and ΔFCF/TA -0.56 > 1.0
NWC/Revenue: 117.6% < 20% (prev 140.0%; Δ -22.36% < -1%)
CFO/TA 0.19 > 3% & CFO 226.7m > Net Income 151.7m
Net Debt (-81.3m) to EBITDA (243.3m): -0.33 < 3
Current Ratio: 4.74 > 1.5 & < 3
Outstanding Shares: last quarter (79.5m) vs 12m ago -2.54% < -2%
Gross Margin: 61.45% > 18% (prev 0.64%; Δ 6.08k% > 0.5%)
Asset Turnover: 51.85% > 50% (prev 48.86%; Δ 3.00% > 0%)
Interest Coverage Ratio: 7.49 > 6 (EBITDA TTM 243.3m / Interest Expense TTM 27.7m)
Altman Z'' 5.70
A: 0.62 (Total Current Assets 942.7m - Total Current Liabilities 199.1m) / Total Assets 1.20b
B: 0.10 (Retained Earnings 118.8m / Total Assets 1.20b)
C: 0.17 (EBIT TTM 207.1m / Avg Total Assets 1.22b)
D: 0.16 (Book Value of Equity 118.8m / Total Liabilities 742.0m)
Altman-Z'' = 5.70 = AAA
Beneish M -2.90
DSRI: 1.05 (Receivables 186.4m/170.4m, Revenue 632.1m/605.3m)
GMI: 1.05 (GM 61.45% / 64.33%)
AQI: 1.12 (AQ_t 0.16 / AQ_t-1 0.14)
SGI: 1.04 (Revenue 632.1m / 605.3m)
TATA: -0.06 (NI 151.7m - CFO 226.7m) / TA 1.20b)
Beneish M = -2.90 (Cap -4..+1) = A
What is the price of BESI shares?

As of May 29, 2026, the stock is trading at EUR 287.60 with a total of 348,307 shares traded.
Over the past week, the price has changed by +6.36%, over one month by +22.23%, over three months by +52.81% and over the past year by +165.76%.

Is BESI a buy, sell or hold?

BE Semiconductor Industries has no consensus analysts rating.

BE Semiconductor Industries (BESI) - Fundamental Data Overview as of 23 May 2026
Market Cap USD = 24.9b (21.4b EUR * 1.1615 EUR.USD)
P/E Trailing = 140.8333
P/E Forward = 70.4225
P/S = 33.8884
P/B = 46.8757
P/EG = 2.2286
Revenue TTM = 632.1m EUR
EBIT TTM = 207.1m EUR
EBITDA TTM = 243.3m EUR
Long Term Debt = 508.1m EUR (from longTermDebt, last quarter)
 Short Term Debt = unknown (none)
 Debt = 530.1m EUR (from shortLongTermDebtTotal, last quarter) + Leases 11.0m
Net Debt = -81.3m EUR (calculated: Debt 530.1m - CCE 611.4m)
Enterprise Value = 21.3b EUR (21.4b + Debt 530.1m - CCE 611.4m)
Interest Coverage Ratio = 7.49 (Ebit TTM 207.1m / Interest Expense TTM 27.7m)
EV/FCF = 115.7x (Enterprise Value 21.3b / FCF TTM 184.4m)
FCF Yield = 0.86% (FCF TTM 184.4m / Enterprise Value 21.3b)
FCF Margin = 29.17% (FCF TTM 184.4m / Revenue TTM 632.1m)
Net Margin = 24.00% (Net Income TTM 151.7m / Revenue TTM 632.1m)
Gross Margin = 61.45% ((Revenue TTM 632.1m - Cost of Revenue TTM 243.6m) / Revenue TTM)
Gross Margin QoQ = 60.30% (prev 63.86%)
Tobins Q-Ratio = 17.80 (Enterprise Value 21.3b / Total Assets 1.20b)
Interest Expense / Debt = 5.22% (Interest Expense 27.7m / Debt 530.1m)
Taxrate = 12.19% (7.16m / 58.7m)
NOPAT = 181.9m (EBIT 207.1m * (1 - 12.19%))
Current Ratio = 3.53 (Total Current Assets 942.7m / Total Current Liabilities 267.3m)
Debt / Equity = 1.16 (Debt 530.1m / totalStockholderEquity, last quarter 456.9m)
Debt / EBITDA = -0.33 (Net Debt -81.3m / EBITDA 243.3m)
Debt / FCF = -0.44 (Net Debt -81.3m / FCF TTM 184.4m)
Total Stockholder Equity = 397.8m (last 4 quarters mean from totalStockholderEquity)
RoA = 12.45% (Net Income 151.7m / Total Assets 1.20b)
RoE = 38.13% (Net Income TTM 151.7m / Total Stockholder Equity 397.8m)
RoCE = 22.86% (EBIT 207.1m / Capital Employed (Equity 397.8m + L.T.Debt 508.1m))
RoIC = 18.19% (NOPAT 181.9m / Invested Capital 999.9m)
WACC = 10.16% (E(21.4b)/V(21.9b) * Re(10.30%) + D(530.1m)/V(21.9b) * Rd(5.22%) * (1-Tc(0.12)))
Discount Rate = 10.30% (= CAPM, Blume Beta Adj.)
Shares (quarterly) Correlation: -95.56 | Cagr: -1.44%
[DCF] Terminal Value 68.25% ; FCFF base≈189.6m ; Y1≈179.8m ; Y5≈169.9m
[DCF] Fair Price = 26.95 (EV 2.05b - Net Debt -81.3m = Equity 2.13b / Shares 79.2m; r=10.16% [WACC]; 5y FCF grow -6.62% → 2.50% )
EPS Correlation: -64.23 | EPS CAGR: -6.95% | SUE: 0.0 | # QB: 0
Revenue Correlation: 47.82 | Revenue CAGR: 1.79% | SUE: -0.17 | # QB: 0
EPS current Quarter (2026-06-30): EPS=1.13 | Chg30d=+23.85% | Revisions=+64% | Analysts=7
EPS next Quarter (2026-09-30): EPS=1.14 | Chg30d=+22.21% | Revisions=+64% | Analysts=7
EPS current Year (2026-12-31): EPS=3.95 | Chg30d=+11.42% | Revisions=+68% | GrowthEPS=+138.1% | GrowthRev=+58.5%
EPS next Year (2027-12-31): EPS=5.93 | Chg30d=+11.35% | Revisions=+78% | GrowthEPS=+50.1% | GrowthRev=+33.9%
[Analyst] Revisions Ratio: +78%